HLD-9110 Epoxy Adhesive

Epoxy adhesive is a high-adhesion glue that is widely used, and Huilida epoxy adhesive is also extensively applied in the aerospace industry. Therefore, it was once known as the “universal adhesive”. Huilida epoxy adhesive features strong adhesion, high bonding strength, a low curing shrinkage rate of about 1%, good medium resistance, excellent electrical performance, convenient application, and low toxicity, making it suitable for bonding various metallic and non-metallic materials. It bonds both homogeneous and dissimilar materials. However, its use is somewhat limited due to high brittleness and insufficient heat resistance. Epoxy potting compound consists of epoxy resin, curing agent, toughening agent, filler, accelerator, coupling agent, and diluent, with the curing agent and epoxy resin being the essential components.